Facilitating Ideas To Production
We Are Distributing Industrial Computers And Embedded Systems From ICOP
Heneng Technology is a Turn-Key EMS (Electronic Manufacturing Service) provider focusing on PCB & PCBA. Heneng Technology provides services for clients with the Best quality, Best price, Best time to market, all tailor-made to clients’ needs. The company’s activities are concentrated in Shenzhen, China with clients from all over the world, such as Russia, United States, UAE, Europe, Asia etc.
Regarding electronic components, we work only with ORIGINAL BRANDS with Original quanlity. Brands we work with includes TDK, ST, Murata, NXP, TOSHIBA, PANASONIC, SAMSUNG, TI, ANALOG DEVICES, MICROCHIP, YAGEO, VISHAY and many more.
“ln order to help our customers facilitate their projects, we are distributing industrial computers and embedded systems from ICOP. We can help you find the right product for your application wether it is a standard form factor or a specialized custom system.”
PCB MANUFACTURING PBC ASSEMBLY PCB COMPONENTS
FEATURED MODELS: ICOP, ADLINK, ADVANTECH
WINSYSYTEMS: Px1-c41s, PcM’c418, PcM-VDx-1, PPM C412, PPM’C407, PPM-tx8OO-G
ADVANTECH: PCM-3365, PCM-3343, PCM-3353, PCM-3356, PCM-9375, PCM-9310, PCM-g365, PCM-9376, AIM8-586, AIMB-585SV, AIMB-s8s, AIM8-505
TFT LCD PANELS
TN LCD PANELS
IPS LCD PANELS
VA LCD PANELS
Heneng Technology electronic manufacturing
Electronic Components Brands
QA and Logistics Service
MANUFACTURING AND ASSEMBLY CAPABILITIES
Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.
- Layers: Up to 42
- Min Line width/spacing(mil) for inner layers: 3.0/3.0
- Min Line width/spacing(mil) for outer layers: 4.0/4.0
- Copper weight: 0.5 – 6.0 OZ
- Max Aspect Ratio: 11:1
- Board thickness: 0.2mm-8.0mm
- Max Panel size: 18″ * 24″
- Min Hole diameter(mil):4
- Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
- Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
- Impedance Control: +/-10%
SMT Production Capabilities
- Max PCB size: 490 x 420 mm
- Min PCB size: 45x45mm
- Board thickness: 0.4-5 mm
- Min Components size: 0201-01005
- Component max height: 25mm
- Min lead pitch:0.35mm
- Min BGA ball pitch:0.4mm
- Placement precision: +/- 0.03mm
- Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um
Andrey, CTO, ROBBOHeneng Consulting helped managed our project from prototype to production,reducing 50% on cost
Trevor Tiffin, CEO, The Luxe Group LtdHeneng Consulting takes the initiative to identify problems and devise solutions. They are a very intelligent team with a mind...
Loay Melahmah, 3DMENAGreat pleasure working with a team with inspiration, commitment and efficiency.
Craig Davidenko,CEO DromemediaAn incredible entrepreneur. His connections and influence in the China markets are priceless.
Sina. Commercial Manager.We checked our samples and it is so clear that your parts have good quality from original manufacturers, so we...
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