Welcome To Visit Us At Hall 4 / 4-634 At Embedded World 2020 In Nuremburg, Germany, Feb. 25-27
Facilitating Ideas To Production
We Are Distributing Industrial Computers And Embedded Systems From ICOP
Heneng Technology is a Turn-Key EMS (Electronic Manufacturing Service) provider focusing on PCB & PCBA. Heneng Technology provides services for clients with the Best quality, Best price, Best time to market, all tailor-made to clients’ needs. The company’s activities are concentrated in Shenzhen, China with clients from all over the world, such as Russia, United States, UAE, Europe, Asia etc.
Regarding electronic components, we work only with ORIGINAL BRANDS with OGIGINAL QUALITY. Brands we work with includes TDK, ST, Murata, NXP, TOSHIBA, PANASONIC, SAMSUNG, TI, ANALOG DEVICES, MICROCHIP, YAGEO, VISHAY and many more.
To better match the needs of our customers, we also provides high quality industrial displays from SONY, PANASONIC, SAMSUNG, LENOVO, JDI, INNOLUX and more.
In order to help our customers facilitate their projects, we are distributing industrial computers and embedded systems from ICOP, such as SOM series and VDX series.
HongKong Office – Heneng Ltd. Address: Suite 2512, Langham Place Office Tower, 8 Argyle Street, Mongkok, Kowloon, Hong Kong Tel: + 852 2150-5712 Fax: + 852 3972-8360
TFT LCD PANELS
TN LCD PANELS
IPS LCD PANELS
VA LCD PANELS
Heneng Technology electronic manufacturing
Electronic Components Brands
QA and Logistics Service
MANUFACTURING AND ASSEMBLY CAPABILITIES
Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.
- Layers: Up to 42
- Min Line width/spacing(mil) for inner layers: 3.0/3.0
- Min Line width/spacing(mil) for outer layers: 4.0/4.0
- Copper weight: 0.5 – 6.0 OZ
- Max Aspect Ratio: 11:1
- Board thickness: 0.2mm-8.0mm
- Max Panel size: 18″ * 24″
- Min Hole diameter(mil):4
- Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
- Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
- Impedance Control: +/-10%
SMT Production Capabilities
- Max PCB size: 490 x 420 mm
- Min PCB size: 45x45mm
- Board thickness: 0.4-5 mm
- Min Components size: 0201-01005
- Component max height: 25mm
- Min lead pitch:0.35mm
- Min BGA ball pitch:0.4mm
- Placement precision: +/- 0.03mm
- Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um
Blog & News
The next generation of the Wi-Fi standard is Wi-Fi 6, also known as 802.11ax, the latest step in a journey of nonstop innovation. The standard builds on the strengths of 802.11ac while adding efficiency, flexibility, and scalability that allows new and existing...read more
By partnering with ICOP, we are offering standard form factor modules from the selection of Q7, Smarc, COMExpress down to ETX based on DMP and Intel SoC. We would like to share with you VDX3-6754 board as an example. Specifications Processor DM&P SoC CPU Vortex86DX3 -...read more
By partnering with ICOP, we are offering standard form factor modules from the selection of Q7, Smarc, COMExpress down to ETX based on DMP and Intel SoC. We would like to share with you VDX3-6726 board as an example. Specifications CPU DM&P SoC Vortex86DX3 1GHz, L1:...read more