Facilitating Ideas To Production

We Are Distributing Industrial Computers And Embedded Systems From ICOP

Company Profile

Heneng Technology is a Turn-Key EMS (Electronic Manufacturing Service) provider focusing on PCB & PCBA. Heneng Technology provides services for clients with the Best quality, Best price, Best time to market, all tailor-made to clients’ needs. The company’s activities are concentrated in Shenzhen, China with clients from all over the world, such as Russia, United States, UAE, Europe, Asia etc.

Regarding electronic components, we work only with ORIGINAL BRANDS with Original quanlity. Brands we work with includes TDK, ST, Murata, NXP, TOSHIBA, PANASONIC, SAMSUNG, TI, ANALOG DEVICES, MICROCHIP, YAGEO, VISHAY and many more.

“ln order to help our customers facilitate their projects, we are distributing industrial computers and embedded systems from ICOP. We can help you find the right product for your application wether it is a standard form factor or a specialized custom system.”

  PCB MANUFACTURING PBC ASSEMBLY  PCB COMPONENTS

 &nbsp

FEATURED MODELS: ICOP, ADLINK, ADVANTECH

ICOP: TVDX3-ElIX, VDX-6354RD, VEX2-6427, VDX3-5754, VEX2 6454, SOM3O4D3, SOM3O4RD-VI

WINSYSYTEMS: Px1-c41s, PcM’c418, PcM-VDx-1, PPM C412, PPM’C407, PPM-tx8OO-G
ADVANTECH: PCM-3365, PCM-3343, PCM-3353, PCM-3356, PCM-9375, PCM-9310, PCM-g365, PCM-9376, AIM8-586, AIMB-585SV, AIMB-s8s, AIM8-505

CONTACT US

Our Products

TFT LCD PANELS

TOUCH PANELS

TN LCD PANELS

IPS LCD PANELS

EMBEDDED SBC

BOX PC

VA LCD PANELS

LED DISPLAY

PDP DISPLAY

QLED DISPLAY

PANEL PC

Our Services

Heneng Technology electronic manufacturing

PCB Manufacturing

PCB Assembly

Engineering Assistance

Electronic Components Brands

QA and Logistics Service

MANUFACTURING AND ASSEMBLY CAPABILITIES

Manufacturing Capacity

Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.

Production Capabilities

  • Layers: Up to 42
  • Min Line width/spacing(mil) for inner layers: 3.0/3.0
  • Min Line width/spacing(mil) for outer layers: 4.0/4.0
  • Copper weight: 0.5 – 6.0 OZ
  • Max Aspect Ratio: 11:1
  • Board thickness: 0.2mm-8.0mm
  • Max Panel size: 18″ * 24″
  • Min Hole diameter(mil):4
  • Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
  • Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
  • Impedance Control: +/-10%

SMT Production Capabilities

  • Max PCB size: 490 x 420 mm
  • Min PCB size: 45x45mm
  • Board thickness: 0.4-5 mm
  • Min Components size: 0201-01005
  • Component max height: 25mm
  • Min lead pitch:0.35mm
  • Min BGA ball pitch:0.4mm
  • Placement precision: +/- 0.03mm
  • Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um

CLIENTS TESTIMONIALS

Blog & News

2021 Spring Festival (Chinese New Year) Holiday Notice

The year of the RAT is finally coming to an end. We are welcoming the year of the OX. 2021 Spring Festival, a.k.a. Chinese New Year (Year of OX) falls on 12 Feb., 2021. As many of you know, it is the most significant festival for all Chinese, like Christmas to...

read more

Year-end Review on the development of Electronics Components

For most of the people, 2020 is finally coming to an end, a promising 2021 is around the corner. What are the current status of the electronic manufacturing supply chains? Manufacturing facilities without adequate space to ensure correct social distancing practices,...

read more

Year-end Review on the PCB Industry from Supply Chain Side

Ever since the lockdown to contain the spread of COVID-19 earlier this year, there has been a conflict between demand and supply. As some of you are aware of, raw materials of PCB have been uprising. Accounts for 30% of the PCB cost structure, CCL is the major...

read more

Send Us a Message

11 + 2 =

Copyright © 2022 Heneng Technology all rights reserved