embedded world – the leading international fair for embedded systems

Be it security for electronic systems, distributed intelligence, the Internet of Things or e-mobility and energy efficiency – the embedded world trade fair in Nuremberg enables you to experience the whole world of embedded systems.

Discover the innovations from the embedded sector, meet experts and acquire new customers: more than 1,100 exhibitors and numerous speakers from 52 countries will be presenting the entire spectrum – ranging from construction elements through modules and full systems, operating systems, hard and software to services – to more than 32,000 trade visitors and approximately 2,200 conference participants from 77 countries.

Heneng Technology, providing the turnkey PCBA solutions for the international markets, will be exhibiting at Embedded World conference 2020 with booth number 4-634.

Heneng Technology provides services for clients by providing solutions for PCB & PCBA needs with the Best quality, Best price, Best time to market, all tailor made to clients’ needs. The company’s activities are concentrated in Shenzhen, China with clients from all over the world, such as Russia, United States, UAE, Europe, Asia etc.

Services we provide includes PCB manufacturing, electronic components procurement, assembly, third-party QA/QC, box-build, logistics and more.

We have multiple years experiences working with clients from medical, industrial automation, aerospacing, Telecomunication, automotive, home appliances sectors. With our turnkey PCBA solutions, we help our clients save their time in product development, reduce their projects costs, facilitate their idea to productions. This is why they constantly come back to us with repeated and new projects.

Production Capabilities

  • Layers: Up to 42
  • Min Line width/spacing(mil) for inner layers: 3.0/3.0
  • Min Line width/spacing(mil) for outer layers: 4.0/4.0
  • Copper weight: 0.5 – 6.0 OZ
  • Max Aspect Ratio: 11:1
  • Board thickness: 0.2mm-8.0mm
  • Max Panel size: 18″ * 24″
  • Min Hole diameter(mil):4
  • Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
  • Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
  • Impedance Control: +/-10%

SMT Production Capabilities

  • Max PCB size: 490 x 420 mm
  • Min PCB size: 45x45mm
  • Board thickness: 0.4-5 mm
  • Min Components size: 0201-01005
  • Component max height: 25mm
  • Min lead pitch:0.35mm
  • Min BGA ball pitch:0.4mm
  • Placement precision: +/- 0.03mm
  • Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um