Welcome To Visit Us At Hall 4 / 4-634 At Embedded World 2020 In Nuremburg, Germany, Feb. 25-27
Facilitating Ideas To Production
We Are Distributing Industrial Computers And Embedded Systems From ICOP
Heneng Technology is a Turn-Key EMS (Electronic Manufacturing Service) provider focusing on PCB & PCBA. Heneng Technology provides services for clients with the Best quality, Best price, Best time to market, all tailor-made to clients’ needs. The company’s activities are concentrated in Shenzhen, China with clients from all over the world, such as Russia, United States, UAE, Europe, Asia etc.
Regarding electronic components, we work only with ORIGINAL BRANDS with OGIGINAL QUALITY. Brands we work with includes TDK, ST, Murata, NXP, TOSHIBA, PANASONIC, SAMSUNG, TI, ANALOG DEVICES, MICROCHIP, YAGEO, VISHAY and many more.
To better match the needs of our customers, we also provides high quality industrial displays from SONY, PANASONIC, SAMSUNG, LENOVO, JDI, INNOLUX and more.
In order to help our customers facilitate their projects, we are distributing industrial computers and embedded systems from ICOP, such as SOM series and VDX series.
HongKong Office – Heneng Ltd. Address: Suite 2512, Langham Place Office Tower, 8 Argyle Street, Mongkok, Kowloon, Hong Kong Tel: + 852 2150-5712 Fax: + 852 3972-8360
TFT LCD PANELS
TN LCD PANELS
IPS LCD PANELS
VA LCD PANELS
Heneng Technology electronic manufacturing
Electronic Components Brands
QA and Logistics Service
MANUFACTURING AND ASSEMBLY CAPABILITIES
Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.
- Layers: Up to 42
- Min Line width/spacing(mil) for inner layers: 3.0/3.0
- Min Line width/spacing(mil) for outer layers: 4.0/4.0
- Copper weight: 0.5 – 6.0 OZ
- Max Aspect Ratio: 11:1
- Board thickness: 0.2mm-8.0mm
- Max Panel size: 18″ * 24″
- Min Hole diameter(mil):4
- Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
- Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
- Impedance Control: +/-10%
SMT Production Capabilities
- Max PCB size: 490 x 420 mm
- Min PCB size: 45x45mm
- Board thickness: 0.4-5 mm
- Min Components size: 0201-01005
- Component max height: 25mm
- Min lead pitch:0.35mm
- Min BGA ball pitch:0.4mm
- Placement precision: +/- 0.03mm
- Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um
Blog & News
By partnering with ICOP, we are offering self-defined form factor module with variety of I/O support to speed up your development time. We would like to share with you SOM304RD board as an example. Specifications SoC DM&P SoC CPU Vortex86DX- 800MHz Cache L1:16K...read more
Top 50 PCB manufactures by revenue in year 2019read more
Click here to browse homepage of Heneng in Embedded World 2020 On 25 February 2020, Embedded World, the leading trade fair started. Over 900 exhibitors from 42 countries and thousands of visitors worldwide came to Nürnberg. The exhibitors presented the entire value...read more