Welcome To Visit Us At Hall 4 / 4-634 At Embedded World 2020 In Nuremburg, Germany, Feb. 25-27

Facilitating Ideas To Production

We Are Distributing Industrial Computers And Embedded Systems From ICOP

Company Profile

Heneng Technology is a Turn-Key EMS (Electronic Manufacturing Service) provider focusing on PCB & PCBA. Heneng Technology provides services for clients with the Best quality, Best price, Best time to market, all tailor-made to clients’ needs. The company’s activities are concentrated in Shenzhen, China with clients from all over the world, such as Russia, United States, UAE, Europe, Asia etc.

Regarding electronic components, we work only with ORIGINAL BRANDS with Original quanlity. Brands we work with includes TDK, ST, Murata, NXP, TOSHIBA, PANASONIC, SAMSUNG, TI, ANALOG DEVICES, MICROCHIP, YAGEO, VISHAY and many more.

“ln order to help our customers facilitate their projects, we are distributing industrial computers and embedded systems from ICOP. We can help you find the right product for your application wether it is a standard form factor or a specialized custom system.”

  PCB MANUFACTURING PBC ASSEMBLY  PCB COMPONENTS

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FEATURED MODELS: ICOP, ADLINK, ADVANTECH

ICOP: TVDX3-ElIX, VDX-6354RD, VEX2-6427, VDX3-5754, VEX2 6454, SOM3O4D3, SOM3O4RD-VI

WINSYSYTEMS: Px1-c41s, PcM’c418, PcM-VDx-1, PPM C412, PPM’C407, PPM-tx8OO-G
ADVANTECH: PCM-3365, PCM-3343, PCM-3353, PCM-3356, PCM-9375, PCM-9310, PCM-g365, PCM-9376, AIM8-586, AIMB-585SV, AIMB-s8s, AIM8-505

CONTACT US

Our Products

TFT LCD PANELS

TOUCH PANELS

TN LCD PANELS

IPS LCD PANELS

EMBEDDED SBC

BOX PC

VA LCD PANELS

LED DISPLAY

PDP DISPLAY

QLED DISPLAY

PANEL PC

Our Services

Heneng Technology electronic manufacturing

PCB Manufacturing

PCB Assembly

Engineering Assistance

Electronic Components Brands

QA and Logistics Service

MANUFACTURING AND ASSEMBLY CAPABILITIES

Manufacturing Capacity

Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.

Production Capabilities

  • Layers: Up to 42
  • Min Line width/spacing(mil) for inner layers: 3.0/3.0
  • Min Line width/spacing(mil) for outer layers: 4.0/4.0
  • Copper weight: 0.5 – 6.0 OZ
  • Max Aspect Ratio: 11:1
  • Board thickness: 0.2mm-8.0mm
  • Max Panel size: 18″ * 24″
  • Min Hole diameter(mil):4
  • Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
  • Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
  • Impedance Control: +/-10%

SMT Production Capabilities

  • Max PCB size: 490 x 420 mm
  • Min PCB size: 45x45mm
  • Board thickness: 0.4-5 mm
  • Min Components size: 0201-01005
  • Component max height: 25mm
  • Min lead pitch:0.35mm
  • Min BGA ball pitch:0.4mm
  • Placement precision: +/- 0.03mm
  • Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um

CLIENTS TESTIMONIALS

Blog & News

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2020 CPCA Show was held Successfully in Shanghai

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