FACILITATING IDEAS TO PRODUCTION
Manufacturing and Assembly Capabilities
Manufacturing Capacity
Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.
Production Capabilities
- Layers: Up to 42
- Min Line width/spacing(mil) for inner layers: 3.0/3.0
- Min Line width/spacing(mil) for outer layers: 4.0/4.0
- Copper weight: 0.5 – 6.0 OZ
- Max Aspect Ratio: 11:1
- Board thickness: 0.2mm-8.0mm
- Max Panel size: 18″ * 24″
- Min Hole diameter(mil):4
- Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
- Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
- Impedance Control: +/-10%
SMT Production Capabilities
- Max PCB size: 490 x 420 mm
- Min PCB size: 45x45mm
- Board thickness: 0.4-5 mm
- Min Components size: 0201-01005
- Component max height: 25mm
- Min lead pitch:0.35mm
- Min BGA ball pitch:0.4mm
- Placement precision: +/- 0.03mm
- Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um


Copyright © 2022 Heneng Technology all rights reserved