Manufacturing Capacity

Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.

Production Capabilities

• Layers: Up to 42
• Min Line width/spacing(mil) for inner layers: 3.0/3.0
• Min Line width/spacing(mil) for outer layers: 4.0/4.0
• Copper weight: 0.5 – 6.0 OZ
• Max Aspect Ratio: 11:1
• Board thickness: 0.2mm-8.0mm
• Max Panel size: 18″ * 24″
• Min Hole diameter(mil):4
• Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
• Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
• Impedance Control: +/-10%

SMT Production Capabilities

• Max PCB size: 490 x 420 mm
• Min PCB size: 45x45mm
• Board thickness: 0.4-5 mm
• Min Components size: 0201-01005
• Component max height: 25mm
• Min lead pitch:0.35mm
• Min BGA ball pitch:0.4mm
• Placement precision: +/- 0.03mm
• Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um