Dielectric Materials in PCB Manufacturing

A PCB is mostly made up of multiple layers of the substrate, copper layering, small holes drilled into the device, solder mask, a coating (quite often in tin-lead), multiple components, before being fused together. Although, when put this way, developing a PCB doesn’t...

read more

Elexcon 2020 Held with New Success

The ELEXCON Electronics Fair has been successfully held for 29 years and is one of the bellwethers of China’s electronics industry, is a global integrated circuits, electronic components, sensors, connectors, wireless, power, electronic materials, smart manufacturing...

read more

2020 CPCA Show was held Successfully in Shanghai

"The 29th International Electronics Circuit Exhibition (Shanghai)" was held in 2020 from AUG 25 to AUG 27 at National Exhibition and Convention Center (Shanghai) by China Printed Circuit Association and Shanghai Ying Zhan Business Service Co., Ltd.. The exhibition...

read more

Everything you need to know about Wifi 6 and Wifi 6E

The next generation of the Wi-Fi standard is Wi-Fi 6, also known as 802.11ax, the latest step in a journey of nonstop innovation. The standard builds on the strengths of 802.11ac while adding efficiency, flexibility, and scalability that allows new and existing...

read more

Embedded Board, System on Module, Self-Defined

By partnering with ICOP, we are offering self-defined form factor module with variety of I/O support to speed up your development time. We would like to share with you SOM304RD board as an example.    Specifications SoC DM&P SoC CPU Vortex86DX- 800MHz Cache L1:16K...

read more

DFM, DFA and DFX ?

There is always issues in the New Product Introduction process. In order to avoid issues, a set of design services is needed, such as DFM, DFA, DFX and more. But, what are the differences between them? DFX: Design for Excellence. Design for Excellence (or Design for...

read more

Copyright © 2020 Heneng Technology all rights reserved